MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 236 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
(Revised) | 9999-99-99 | |
| 235 |
Composites Part BBending performance of novel curved sandwich structures featuring 3D printed continuous carbon fiber reinforced composite corrugated core with railway interlockingHui-Jin Um, Na-Hyun Jeon, Hyun-Ji Rho, Ji-Hwan Shin and Hak-Sung Kim |
(Submitted) | 9999-99-99 | |
| 234 |
Energy Conversion and Management: XEnhancing Cold Storage Efficiency: Continuous DDPG Approach for Energy Consumption Minimization Utilizing Strategic Sensor Input DataJong-Whi Park, Young-Min Ju, and Hak-Sung Kim |
(Revised) | 9999-99-99 | |
| 233 |
ACS Materials LettersSynergistic Role of Bi, Ni, and Pd Alloying in SAC305 for Enhanced IMC Suppression and Superior Thermo-Mechanical PerformanceYou-Gwon Kim, Heon-Su Kim, Tae Wan Kim, Hyeong-Bin Park, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin Gyu Kim, Hak-Sung Kim |
(Submitted) | 9999-99-99 | |
| 232 |
Applied Surface ScienceIn-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopySang-Il Kim and Hak-Sung Kim |
(Submitted) | 9999-99-99 |