ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 257 |
Results in engineeringNon-destructive evaluation of PET thermally induced structural transformation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 256 |
MeasurementIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic wavesSang-Il Kim, Heon-Su Kim, Tae-Wan Kim, Jinsang Lim, Dong-Su Han, Hae Gu Lee, and Hak-Sung Kim |
(accepted) | 9999.99.99 | |
| 255 |
Journal of Materials Processing TechnologyMulti-Physics Coupled Modeling of Process-Induced Warpage in Advanced Fan-Out Wafer-Level Semiconductor PackagesJeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An , Gyung-Hwan Oh, Dong-Woon Park, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 254 |
Composites Part ADevelopment of the modified V-notched rail shear test for carbon fiber reinforced composites with multi-scale simulation method considering microscopic failure pointsGyu-Won Kim, Hyun-Ji Rho, Young-Wu Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, Jong-Whi Park, and Hak-Sung Kim |
(Submitted) | 9999-99-99 | |
| 253 |
Construction and Building MaterialsOptimization and field evaluation of a detachable thermal insulation fabric for rail temperature mitigationJuyeop Park, Donghoon Kang, Hak-Sung Kim |
500 | 2025.10.22 |