번호 제목 권(호) 출판년도
253

Materials & Design

Effect of electroplating current density and post-annealing on the warpage and reliability of redistributed layer for advanced semiconductor package

Taek-Hyeon Kim, Jeong-Hyeon Baek, Sang-Il Kim, Tae-Hoon Kim, Ji-Hye Shim and Hak-Sung Kim

(Submitted) 99999.99.99
252

Materials & Design

Non-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopy

Tae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim

(Submitted) 9999.99.99
251

Archive of Compututational Methods in Engineering

Fast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenization

Woong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim

(Submitted) 9999.99.99
250

Measurement

In-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic waves

Sang-Il Kim†, Heon-Su Kim†, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim

(Sumitted) 9999.99.99
249

Composite Part B

A Critical Review of the Past, Present, and Future of 3D Printing for Continuous and Short Fiber Composites

Sanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim

(Submitted) 9999.99.99