ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 254 |
Materials & DesignNon-destructive evaluation of PET thermally induced structural transformation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Revised) | 9999.99.99 | |
| 253 |
Archive of Compututational Methods in EngineeringFast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenizationWoong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 252 |
MeasurementIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic wavesSang-Il Kim†, Heon-Su Kim†, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim |
(Major review) | 9999.99.99 | |
| 251 |
Composite Part BA Critical Review of the Past, Present, and Future of 3D Printing for Continuous and Short Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 250 |
Journal of Materials Processing TechnologyMulti-Physics Coupled Modeling of Process-Induced Warpage in Advanced Fan-Out Wafer-Level Semiconductor PackagesJeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An , Gyung-Hwan Oh, Dong-Woon Park, and Hak-Sung Kim |
(Submitted) | 9999.99.99 |