ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 253 |
Materials & DesignEffect of electroplating current density and post-annealing on the warpage and reliability of redistributed layer for advanced semiconductor packageTaek-Hyeon Kim, Jeong-Hyeon Baek, Sang-Il Kim, Tae-Hoon Kim, Ji-Hye Shim and Hak-Sung Kim |
(Submitted) | 99999.99.99 | |
| 252 |
Nano ConvergenceAdvanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach PasteYoung-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Jinho Ahn and Hak-Sung Kim |
(Revised) | 99999.99.9 | |
| 251 |
Journal of Materials Research and TechnologySynergistic Role of Bi, Ni, and Pd Alloying in SAC305 for Enhanced IMC Suppression and Superior Thermo-Mechanical PerformanceYou-Gwon Kim, Heon-Su Kim, Tae Wan Kim, Hyeong-Bin Park, Jong-Whi Park, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin Gyu Kim, Hak-Sung Kim |
(Revised) | 99999-99-99 | |
| 250 |
Materials & DesignNon-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 249 |
Archive of Compututational Methods in EngineeringFast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenizationWoong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim |
(Submitted) | 9999.99.99 |