MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 216 |
ACS Applied Electronic MaterialsThermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding CompoundYong-Rae Jang, Sang-Jun Park, Jeong-Hyeon Baek, Tae-Hwa Kim and Hak-Sung Kim |
5 | 2023-10-09 | |
| 215 |
Advanced Composites and Hybrid MaterialsHigh-performance multifunctional energy-storage corrugated lattice core sandwich structure via continuous carbon fiber (CCF)/Polyamide 6 (PA6) 3D printingHui-Jin Um, Na-Hyun Jeon, Ji-Hwan Shin and Hak-Sung Kim |
6 | 182 | 2023-10-03 |
| 214 |
Engineering Fracture MechanicsMixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moistureHui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
289 | 09429 | 2023-09-01 |
| 213 |
Composite StructuresPrediction of stress-strain behavior of carbon fabric woven composites by deep neural networkDug-Joong Kim, Gyu-Won Kim, Jeong-hyeon Baek, Byeunggun Nam, Hak-Sung Kim |
318 | 117073 | 2023-08-15 |
| 212 |
Polymer TestingIn-situ non-contact monitoring algorithm for PET crystallinity and moisture content using Terahertz time-domain spectroscopySang-Il kim, Dong-Woon Park, Heon-Su Kim, and Hak-sung Kim |
124 | 108085 | 2023-07-01 |