ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
224 |
비파괴검사학회지테라헤르츠파를 사용한 반도체 패키지 내부 칩 정렬 비파괴 검사 기술에 관한 연구Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
44(3) | 165-171 | 2024-06-14 |
223 |
Applied ScienceInvestigation of Frequency-Dependent Characteristics of Wire Rope under Tension Based on Transfer Function MethodKwanghun Jeong, Narae Kim, Nahyun Jeon, Haksung Kim and Junhong Park |
14(11) | 4621 | 2024-05-28 |
222 |
Composites Part BAccuracy enhancement for airbag deployment simulations considering the strain rate and temperature-dependent mechanical properties of thermoplastic olefin and polypropyleneSe-Min Lee, In-Soo Han, Gyu-Won Kim, Jae-Hyun An, Hak-Sung Kim |
275 | 111292 | 2024-04-15 |
221 |
Journal of Power SourcesDeep neural network-based lifetime diagnosis algorithm with electrical capacitor accelerated life testSeok-Hoon Jeong, Jong-Whi Park, and Hak-Sung Kim |
599 | 234182 | 2024-04-15 |
220 |
International Journal of Precision Engineering and Manufacturing-Green TechnologyFlashlight Sintering Characteristics of the Inkjet-Printed Nanosized Copper Ink on an Auxiliary Heated Paper SubstrateSungjun Choi, Yong‑Rae Jang, Hak‑Sung Kim, Caroline Sunyong Lee |
11(2) | 365-379 | 2024-03 |