ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 223 |
Nano ConvergenceAdvanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach PasteYoung-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Jinho Ahn and Hak-Sung Kim |
(Submitted) | 99999.99.9 | |
| 222 |
Polymer TestingNon-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 221 |
Archive of Compututational Methods in EngineeringFast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenizationWoong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 220 |
NDT & E InternationalIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electro-magnetic waveHeon-Su Kim, Sang-Il Kim, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim |
(Sumitted) | 9999.99.99 | |
| 219 |
Composite Part BA Critical Review of the Past, Present, and Future of 3D Printing for Continuous and Short Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
(Submitted) | 9999.99.99 |