ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 218 |
Composite Part ARepeated impact behavior of multifunctional carbon fiber reinforced plastic composites sandwich structures with 3D printed novel rail interlocking coreHyun-Ji Rho, Hui-Jin Um, Ji-Hwan Shin, Hak-Sung Kim |
199 | 109235 | 2025-08-11 |
| 217 |
Nano ConvergenceAdvanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach PasteYoung-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Jinho Ahn and Hak-Sung Kim |
12(38) | 2025-07-23 | |
| 216 |
ADVANCED MATERIALS TECHNOLOGIESAdvanced Optical Integration Processes for Photonic-Integrated Circuit PackagingKeuntae Baek, Minhyeok Kim, Hak-Sung Kim, Jinho Ahn, and Hongyun So |
10(19) | e01848 | 2025-06-25 |
| 215 |
Transactions on Components, Packaging and Manufacturing TechnologyDetermination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder JointYongrae Jang, You-Gwon Kim, Hak-Sung Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Bongtae Han |
15(10) | 2152-2159 | 2025-06-13 |
| 214 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
17 (27) | 39694–39707 | 2025-06-09 |